Chip-On-Board Technology - ISSI provides custom electronic design and manufacturing for a variety of industries, the U.S. military, and OEMs. International Sensor Systems offers five technologies - Multichip Module, Thick Film Hybrid, Chip-on-Board, Surface Mount, and Through-Hole.





				Chip-On-Board Technology Chip-On-Board (COB) is a well-established technology that delivers an intermediate level of miniaturization, along with the advantages of in-process testing and repair. Chip-On-Board is the direct attachment of bare die to laminate printed circuit boards, and has advantages such as low tooling cost and the capability to handle high input/output counts. Chip-On-Board is an appropriate technology where circuit size is a design consideration. Packages Available for Chip-On-Board Placement at ISSI: Discrete Components down to 0402 size Quad Flat Pack (QFP), Thin Small Outline Package (TSOP) Small Outline Integrated Circuit (SOIC), Plastic Leaded Chip Carrier (PLCC) Features of Chip-On-Board: Further space savings over Surface Mount Technology assembly Single and double-sided assemblies Single or multi-layer base materials Rigid or flex laminates available Full layout and design capabilities to customer's print Full turn-key assembly Production capabilities from prototype quantities through large volume Automatic discrete component assembly capabilities for accurate placement down to 0.001 inch with pitches to 0.0018 inch Thermosonic and ultrasonic wire bonding utilizing gold and aluminum wire ranging from 0.0007 inch to 0.003 inch in diameter Reflow soldered passive and active components Functional and environmental testing available Assembled and Inspected to IPC-A-610 Rev B Selection of glob top and/or lid packaging techniques available



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