Thick Film Hybrid Technology - ISSI provides custom electronic design and manufacturing for a variety of industries, the U.S. military, and OEMs. International Sensor Systems offers five technologies - Multichip Module, Thick Film Hybrid, Chip-on-Board, Surface Mount, and Through-Hole.





		Hybrid Circuit A hybrid circuit is a device that performs all or part of an electronic function by combining and interconnecting several passive and active semiconductor devices into a single package. The base material of the hybrid consists of a substrate -- Alumina (Al2O3), Aluminum Nitride (AlN) or Beryllia (BeO) -- with screen printed thick film resistors and conductor patterns. The printed pastes are then fired in temperature controlled, multi-zone furnaces -- fusing the pastes to the base material and becoming an integral part of the circuit. Passive and active semi-conductor packages are reflowed onto the printed substrate. Bare die are then attached with epoxy and interconnected with gold or aluminum wire bonds to the printed substrate. International Sensor Systems' hybrid circuits provide superior circuit density, performance, and reliability, with relatively low development and tooling costs. Packages Available for Hybrid Thick Film Assembly at ISSI: Single-Inline-Package (SIP), Dual-Inline-Package (DIP) Ceramic, Metal or Plastic covers with adhesive seal Silicone or epoxy junction coatings (glob top) to protect wire bonds Protective circuit assembly epoxy conformal coatings Hermetic and non-hermetic Features of Hybrid Thick Film Technology from ISSI: Further space savings over Surface Mount Technology and Chip-On-Board Alumina (Al2O3), Aluminum Nitride (AlN), and Beryllia (BeO) base material available Very compact with low profile and low mass Provides reliable performance in extreme temperature operating range Superior Base Material Power Dissipation -Alumina (Al2O3)High Level ~ 1 Watt per inch per degree C -Aluminum Nitride (AlN) Higher Level ~ 7 Watts per inch per degree C Printed thick film resistors range in value from 0.1 ohm to 300 megohm -Temperature Coefficient Resistance (TCR) as low as 50 ppm with tracking TCR's to 20 ppm -Power ratings range one-sixteenth (1/16) to five (5) Watts Automated Laser Trimming of Resistors -Precision Resistors to one-tenth of one percent (0.1%) -Ratio Matching to one-tenth of one percent (0.1%) Epoxy and eutectic semi-conductor die attach Gold and aluminum thermosonic and ultrasonic wire bonding with wire diameters from 0.0007 inch to 0.003 inch Reflow soldered passive component attachment Wide selection of solder/paste available Functional modularity Test Equipment used in manufacturing is in accordance with MIL-I-45208 (Inspection System Requirements) and MIL-STD-45662 (Calibration System Requirements) In-process testing and inspection procedures of Hybrid Thick Film Circuits in accordance with MIL-STD-883 (Test Methods & Procedures for Microelectronics) Improved signal to noise ratio over laminate technologies

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