Multichip Module Technology - ISSI provides custom electronic design and manufacturing for a variety of industries, the U.S. military, and OEMs. International Sensor Systems offers five technologies - Multichip Module, Thick Film Hybrid, Chip-on-Board, Surface Mount, and Through-Hole.





		Multichip Module Technology Multichip Module (MCM) is a relatively new term in the electronics industry, but it's certainly nothing new to ISSI. In fact, we've been manufacturing these combined-technology, functional modules for nearly 20 years. MCM technology mounts multiple, unpackaged integrated circuits (bare die) -- along with signal conditioning or support circuitry such as capacitors and resistors -- on a single laminate or ceramic base material. With reduced size and weight, Multichip Modules offer a practical approach to reducing overall system size. The MCM footprint is much smaller than conventional single chip packages, resulting in a smaller motherboard, AND the potential for smaller space requirements for panels, enclosures, and cabling. The result is a high-density module that resembles a single component when mounted on your printed circuit board. By combining more circuit functions in one Multichip Module, fewer system assemblies are required, resulting in lower cost. Lower circuit design costs, integrated functional testing, and higher manufacturing yields enhance the possibilities for this technology in your project. Features of Multichip Module Technology from ISSI: Reduced size and weight -- MCMs offer a practical approach to reducing overall system size Smallest size and weight of the five technologies offered by ISSI Alumina (Al2O3), Aluminum Nitride (AlN), Beryllia (BeO), or laminate base materials Efficient package power dissipation Multi-layer conductor patterns for the most efficient space utilization Increased performance -- The compact MCM package design decreases electrical signal transmission time Greater reliability -- Fewer interconnects than Through-Hole PCB or Surface Mount Technologies Full layout and design capabilities MIL-STD-883 fabrication and screening Test Equipment used in manufacturing is in accordance with MIL-I-45208 (Inspection System Requirements) and MIL-STD-45662 (Calibration System Requirements) In-process testing and inspection procedures of Multichip Modules in accordance with MIL-STD-883 (Test Methods & Procedures for Microelectronics) Thick or thin film resistors -- range from 0.1 ohm to 300 megohm Die and wire; flip chip Integrated Circuit connections available Reflow or epoxy attach passive components Hermetic and non-hermetic package styles available Excellent environmental characteristics -- reliable in non-ambient conditions Full electrical and environmental testing available Improved signal to noise ratio

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