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International
Sensor Systems. Are you looking for an electronic manufacturer with the capability to assemble your electronic circuits using a number of different technologies? With the flexibility to turn out high-quality circuits on time and on budget? A full-service manufacturer offering professional design and engineering services? In short, are you looking for a connection to a custom circuit manufacturer that gives you one, cost-effective source for fully-tested, functional electronic assemblies? If that's what you need to bring your project to life, you'll find it all from International Sensor Systems -- one of the nation's leading manufacturers of Multichip Modules, Thick Film Hybrid Circuits, Surface Mount printed circuit board assemblies, and Through-Hole printed circuit assemblies. Our Capabilities
We also offer design and testing services, enabling our customers to use International Sensor Systems as a single, cost-effective source for a variety of electronic circuits. Company Philosophy International Sensor Systems has a solid foundation dedicated to customer service and satisfaction. Each customer and each project -- large or small -- is given the full attention and resources of our management, technical, and production team. Commitment to providing quality service and products is our primary hallmark. We invite you to find out more about our qualifications, to meet personally with our team, to inspect our plant and equipment, and to put our world-class enthusiasm to work on your project. |
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Copyright © 2000 International
Sensor Systems, Inc.
All Rights Reserved
Site Design and Development by Idea Bank Marketing, Inc.
ISSI provides custom electronic design and manufacturing for a variety of industries, the U.S. military, and OEMs. International Sensor Systems offers five technologies - Multichip Module, Thick Film Hybrid, Chip-on-Board, Surface Mount, and Through-Hole. custom,custom package,custom manufacturing,custom electronic,electronic,custom electronic design,circuit design,circuit,circuit assembly,assembly,chip-on-board,chip on board,COB,hybrid,thick film,thick film hybrid,IC,laser trim,MCM,multichip module,multichip,PCB,printed circuit board,QFP,semiconductor,SMT,surface mount,through-hole,through hole,abrasive trim,alumina,aluminum nitride,Association Connecting Electronics Industries,ANSI,automatic placement,ball bonding,beryllia,burn-in,CAD,capacitor,ceramic,cermet,chip,co-fired,computer aided design,conductors,conductive,conformal coat,contract manufacturing,design,die,die bond,dielectrics,DIP,dual-in-line-package,dual in-line package,dual inline package,electrical test,electronic,engineering,environmental test,eutectic,film,fine pitch,firing,flex circuit,flip chip,gold,handsolder,high density interconnect,interconnect,input,inspect,integrated circuit,IPC,kevlar,laminate,layout,metalization,military standards,MIL-STD,miniaturization,module,multichip,multilayer,multi-layer,network,output,palladium silver,pick and place,pitch,plastic leaded chip carrier,plcc,plated through-hole,platinum gold,platinum silver,polymide,polymers,print,printed through hole,printed wire board,process control,proto-type,prototype,PTH,PWB,quad flat pack,quality assurance,QA,QC,quality control,reflow,resistor,screen,services,silver,single-inline-package,single in-line package,single-in-line-package,SIP,small outline integrated circuit,small outline package,SOIC,solder,SOT,substrate,technology,high-tech,high tech,TCR,temperature coefficient resistance,test,thick,thick film inks,thick film pastes,thin small outline package,thin small-outline package,TSOP,trimming,TSOT,turnkey,wave,wave solder,wave-solder,wedge bonding,wire bonding.