Site Map - ISSI provides custom electronic design and manufacturing for a variety of industries, the U.S. military, and OEMs. International Sensor Systems offers five technologies - Multichip Module, Thick Film Hybrid, Chip-on-Board, Surface Mount, and Through-Hole.

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ISSI provides custom electronic design and manufacturing for a variety of industries, the U.S. military, and OEMs. International Sensor Systems offers five technologies - Multichip Module, Thick Film Hybrid, Chip-on-Board, Surface Mount, and Through-Hole. custom,custom package,custom manufacturing,custom electronic,electronic,custom electronic design,circuit design,circuit,circuit assembly,assembly,chip-on-board,chip on board,COB,hybrid,thick film,thick film hybrid,IC,laser trim,MCM,multichip module,multichip,PCB,printed circuit board,QFP,semiconductor,SMT,surface mount,through-hole,through hole,abrasive trim,alumina,aluminum nitride,Association Connecting Electronics Industries,ANSI,automatic placement,ball bonding,beryllia,burn-in,CAD,capacitor,ceramic,cermet,chip,co-fired,computer aided design,conductors,conductive,conformal coat,contract manufacturing,design,die,die bond,dielectrics,DIP,dual-in-line-package,dual in-line package,dual inline package,electrical test,electronic,engineering,environmental test,eutectic,film,fine pitch,firing,flex circuit,flip chip,gold,handsolder,high density interconnect,interconnect,input,inspect,integrated circuit,IPC,kevlar,laminate,layout,metalization,military standards,MIL-STD,miniaturization,module,multichip,multilayer,multi-layer,network,output,palladium silver,pick and place,pitch,plastic leaded chip carrier,plcc,plated through-hole,platinum gold,platinum silver,polymide,polymers,print,printed through hole,printed wire board,process control,proto-type,prototype,PTH,PWB,quad flat pack,quality assurance,QA,QC,quality control,reflow,resistor,screen,services,silver,single-inline-package,single in-line package,single-in-line-package,SIP,small outline integrated circuit,small outline package,SOIC,solder,SOT,substrate,technology,high-tech,high tech,TCR,temperature coefficient resistance,test,thick,thick film inks,thick film pastes,thin small outline package,thin small-outline package,TSOP,trimming,TSOT,turnkey,wave,wave solder,wave-solder,wedge bonding,wire bonding.