Surface Mount Technology - ISSI provides custom electronic design and manufacturing for a variety of industries, the U.S. military, and OEMs. International Sensor Systems offers five technologies - Multichip Module, Thick Film Hybrid, Chip-on-Board, Surface Mount, and Through-Hole.





		Surface Mount Technology Surface Mount Technology is a mature approach to device mounting and remains one of the most economical technologies for many applications. ISSI's surface mount on printed circuit board capability provides excellent space utilization, and a very high degree of circuit reliability at a relatively low cost. Advances in semiconductor manufacturing have made small outline packages available for a wide selection of components. After screen printing solder paste on the printed circuit board, these components are positioned using automatic surface mount placement equipment and reflow soldered into place. International Sensor Systems offers the latest in Surface Mount technology, with placement accuracy of ± 0.001 inch. Packages Available for Surface Mount Placement at ISSI: Discrete components down to 0402 size Quad Flat Pack (QFP), Thin Small Outline Package (TSOP) Small Outline Integrated Circuit (SOIC), Plastic Leaded Chip Carrier (PLCC) Features of Surface Mount Technology from ISSI: Up to 10 times size reduction over Through-Hole assembly Wide range of base materials available: Laminates, Alumina (96% A12O3), Aluminum Nitride (AIN), Flex Single and double-sided assemblies Single or multi-layer base materials Full layout and design capabilities to customer's print Full turn-key assembly Production capabilities from prototype quantities through large volume Automatic assembly capabilities for accurate placement down to 0.001 inch with pitches to 0.018 inch Functional and environmental testing available Assembled and Inspected to MIL-STD-883 and IPC-A-610 Rev B, Class 3 specifications Selection of high and low temperature solders available Selection of conformal epoxy coatings available Improved signal to noise ratio when using ceramic base material

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