Through-Hole Technology - ISSI provides custom electronic design and manufacturing for a variety of industries, the U.S. military, and OEMs. International Sensor Systems offers five technologies - Multichip Module, Thick Film Hybrid, Chip-on-Board, Surface Mount, and Through-Hole.




			Through-Hole Technology When conventional Through-Hole printed circuit board assembly is required, ISSI can deliver high quality circuits at reasonable prices. Our experienced assembly team ensures that all discrete components are accurately assembled by through-hole placement, and wave soldered at precise temperatures for the best possible structural integrity. After the cleaning process, we perform rigorous inspections and electrical testing. Features of Through-Hole Technology from ISSI: Lowest cost assembly technique Multiple laminate materials available: Epoxy-glass, Polyimide-Kevlar 1 and 2 oz. Copper traces for high power applications Single and double-sided assembly Up to eight-layer boards Trace width spaces to 3 mil (0.003 inch) Solvent or aqueous based cleaning systems Full functional testing capabilities Inspection to IPC-A-610 RevB Standards




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