Comparison Chart


Multichip Module Thick film Hybrid Chip-on-Board Surface Mount Through Hole
Description Utilizes multiple unpackaged die on a single, multi-layer laminate or ceramic substrate Utilizes thick film technology on ceramic substrate. Component attachment may be surface mount or die and wire. May utilize printed resistors. Utilizes die and wire technology on rigid or flex laminate substrate Utilizes surface mount technology on rigid or flex laminate substrate Utilizes through hole technology on rigid or flex laminate printed circuit board (PCB)
Base
Material
Alumina (AL2O3), Aluminum Nitride (AIN). Beryllia (BeO)
Glass Epoxy
Polyimide-Kevlar
Laminate sheets Flex
Alumina (AL2O3),
Aluminum Nitride (AIN),
Beryllia (BeO)
Glass-Epoxy
Polyimide-Kevlar
Laminate sheets
Flex
Glass Epoxy
Polyimide-Kevlar
Laminate sheets
Flex
Glass-Epoxy
Polyimide-Kevlar
Laminate sheets
Flex
Conductors Gold (Au)
Palladium Gold (PdAu)
Platinum (Pt
Silver (Ag
Palladium Silver (PdAg)
Copper (Cu)
Gold (Au)
Palladium Gold (PdAu)
Platinum (Pt)
Silver (Ag)
Palladium Silver (PdAg)
Copper (Cu)
with Gold plated pads
Copper (Cu) Copper (Cu)
Resistors Surface mount packages
Cermet screened on resistive material
Surface mount packages
Cermet screened on resistive material
Surface mount packages Surface mount packages Through hole packages
Processes Sequence:
Print, Dry, Fire
(conductor, dielectric, resistor pastes)
  • Automated surface mount component placement
  • Reflow solder
  • Die Attach
  • Wire bonding
Sequence:
Print, Dry, Fire
(conductor, dielectric, resistor pastes)
  • Automated surface mount component placement
  • Reflow solder
  • Die Attach
  • Wire bonding
Sequence:
  • Screen solder paste
  • Automated surface mount component placement
  • Reflow solder
  • Die Attach
  • Wire bonding
Sequence:
  • Screen solder paste
  • Automated surface mount component placement
  • Reflow solder
Sequence:
  • Through hole insertion
  • Wave Solder