Surface Mount

SMT provides excellent space utilization, and a very high degree of circuit reliability. Surface Mount Technology remains one of the most economical technologies for many applications.

Advances in semiconductor manufacturing have made small outline packages available for a wide selection of components. After screen-printing solder paste on the printed circuit board, these components are positioned using automatic surface mount placement equipment and reflow soldered to the substrate. International Sensor Systems offers the latest in Surface Mount Technology, with multiple surface mount placement machines; we have the technology and flexibility to build your surface mount circuits. 

Features of Surface Mount Technology:

  • Automatic surface mount assembly capabilities for accurate placement
  • Fine pitch and BGA placement capabilities
  • Wide range of base materials available including glass epoxy, ceramic, alumina (96% AL2O3), Aluminum nitrate (AIN), and flex
  • Single or double-sided assemblies
  • Full layout and design capabilities to customer’s print
  • Manufacturing capabilities from prototype quantities through production volume
  • Assembled, inspected, and tested to MIL-STD and IPC specifications
  • Electrical and environmental testing available
  • Full turn key available
  • RoHs assembly available. 
  • Selection of conformal coatings available

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