Our through-hole assembly procedure can handle both leaded and lead-free (RoHs) applications. Precise component interconnections and exact soldering temperatures provide superior solder joint integrity.
Our through-hole assembly procedure can handle both leaded and lead-free (RoHs) applications. Precise component interconnections and exact soldering temperatures are combined to provide superior solder joint integrity. Our circuits are inspected throughout the assembly process to ensure a high quality final product. As an added feature, ISSI can assist the customer with the conversion from a Through Hole package to Surface Mount Technology.
ISSI Capabilities:
- Single and double-sided assemblies
- Multi-layer boards
- Cost effective assembly technique
- Electrical and environmental testing
- Assembled, inspected, and tested to MIL-STD and IPC specifications
