MANUFACTURING

Chip-On-Board

When design parameters cannot be met by traditional assembly techniques, Chip-On-Board (COB) could be the solution. COB is an excellent choice for miniaturizing your electrical circuit.
An unpackaged integrated circuit (IC) is mounted to a laminate substrate along with signal conditioning or support circuitry. Electrical connections are formed when the IC is attached to the corresponding substrate interconnects with gold wire bonding. A junction coating material can then be applied on top of the die to protect the die and wire bonds.

COBs primary advantage is that it reduces the weight and mass of the circuit. When this is a primary concern, Chip-On-Board technology is you circuit miniaturization solution.

Single and double-sided assemblies

Single or multi-layer substrate materials

Reduces overall circuit size and weight

Thermosonic wire bonding utilizing gold wire ranging from .007” to .003” in diameter

Circuit sealing using a variety of lids or conventional coating material

Further space saving over most conventional Surface Mount Technology assembly

Rigid or Flex laminate substrates available

Package layout and design capabilities

Manufacturing capabilities from prototype quantities through production volume

Automatic, discrete component assembly capabilities for accurate placement of the latest miniaturized components

Re-flow soldered passive and active components

Functional and environmental testing available

Assembled, tested, and inspected to MIL-STD and IPC specifications

Full turnkey assemblies available

Want to know how we can help your business?

Which technology is right for you?

Check out our comparison chart.

SURFACE MOUNT

SURFACE MOUNT
SMT provides excellent space utilization and a very high degree of circuit reliability.
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THROUGH-HOLE PCB

THROUGH-HOLE PCB
Our through-hole PCB assembly procedure can handle both leaded and lead-free (RoHs) applications.
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HYBRID THICK FILM

HYBRID THICK FILM
A Hybrid circuit performs all or part of an electronic function by combining and interconnecting...
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CHIP ON-BOARD

CHIP ON-BOARD
When design parameters cannot be met by traditional assembly techniques, Chip-On-Board (COB)...
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MULTI-CHIP MODULE

MULTI-CHIP MODULE
MCM has the same basic construction as Chip-On-Board but with some significant differences.
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International Sensor Systems is a manufacturer of custom electronic assemblies. Our Mission is to supply superior product quality and excellent customer service to the Industrial, Military, and Medical marketplaces. We have a dedicated staff of employees who are an essential part of our buisness. Using advanced technology, ISSI consistantly meets or exceeds our customers' expectations.

CONTACT US

103 Grant Street, PO Box 345
Aurora, NE 68818
Phone: 402-694-6111
Toll-Free: 800-260-6287
Fax: 402-694-6180