COBs primary advantage is that it reduces the weight and mass of the circuit. When this is a primary concern, Chip-On-Board technology is you circuit miniaturization solution.
Single and double-sided assemblies
Single or multi-layer substrate materials
Reduces overall circuit size and weight
Thermosonic wire bonding utilizing gold wire ranging from .007” to .003” in diameter
Circuit sealing using a variety of lids or conventional coating material
Further space saving over most conventional Surface Mount Technology assembly
Rigid or Flex laminate substrates available
Package layout and design capabilities
Manufacturing capabilities from prototype quantities through production volume
Automatic, discrete component assembly capabilities for accurate placement of the latest miniaturized components
Re-flow soldered passive and active components
Functional and environmental testing available
Assembled, tested, and inspected to MIL-STD and IPC specifications
Full turnkey assemblies available
Want to know how we can help your business?
International Sensor Systems is a manufacturer of custom electronic assemblies. Our Mission is to supply superior product quality and excellent customer service to the Industrial, Military, and Medical marketplaces. We have a dedicated staff of employees who are an essential part of our buisness. Using advanced technology, ISSI consistantly meets or exceeds our customers' expectations.