When design parameters cannot be met by traditional assembly techniques, Chip On Board (COB) could be the solution. Chip On Board is an excellent choice for miniaturizing your electrical circuit.
An unpackaged integrated circuit (IC) is mounted to a laminate substrate along with signal conditioning or support circuitry. Electrical connections are formed when the IC is attached to the corresponding substrate interconnects with gold wire bonding. A junction coating material can then be applied on top of the die to protect the die and wire bonds.
Chip on Board’s primary advantage is that it reduces the weight and mass of the circuit. When this is a primary concern, Chip On Board technology is your circuit miniaturization solution.
Single and double-sided assemblies
Single or multi-layer substrate materials
Reduces overall circuit size and weight
Thermosonic wire bonding utilizing gold wire ranging from .007” to .003” in diameter
Circuit sealing using a variety of lids or conventional coating material
Further space saving over most conventional Surface Mount Technology assembly
Rigid or Flex laminate substrates available
Package layout and design capabilities
Manufacturing capabilities from prototype quantities through production volume
Automatic, discrete component assembly capabilities for accurate placement of the latest miniaturized components
Re-flow soldered passive and active components
Functional and environmental testing available
Assembled, tested, and inspected to MIL-STD and IPC specifications
Full turnkey assemblies available
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International Sensor Systems is a manufacturer of custom electronic assemblies. Our Mission is to supply superior product quality and excellent customer service specifically to the Industrial, Military, and Medical marketplaces. We have a dedicated staff of employees who are undeniably an essential part of our business. In addition, using advanced technology, ISSI consistently meets or exceeds our customers' expectations.