MANUFACTURING
Comparison Chart
| Multichip Module | Thick film Hybrid | Chip-on-Board | Surface Mount | Through Hole | |
|---|---|---|---|---|---|
| Description | Utilizes multiple unpackaged die on a single, multi-layer laminate or ceramic substrate. | Utilizes thick film technology on ceramic substrate. Component attachment may be surface mount or die and wire. May utilize printed resistors. | Utilizes die and wire technology on rigid or flex laminate substrate | Utilizes surface mount technology on rigid or flex laminate substrate | Utilizes through hole technology on rigid or flex laminate printed circuit board (PCB) |
| Base Material | Alumina (AL2O3), Aluminum Nitride (AIN). Beryllia (BeO) Glass Epoxy Polyimide-Kevlar Laminate sheets Flex | Alumina (AL2O3), Aluminum Nitride (AIN), Beryllia (BeO) | Glass-Epoxy Polyimide-Kevlar Laminate sheets Flex | Glass Epoxy Polyimide-Kevlar Laminate sheets Flex | Glass-Epoxy Polyimide-Kevlar Laminate sheets Flex |
| Conductors | Gold (Au) Palladium Gold (PdAu) Platinum (Pt Silver (Ag Palladium Silver (PdAg) Copper (Cu) | Gold (Au) Palladium Gold (PdAu) Platinum (Pt) Silver (Ag) Palladium Silver (PdAg) | Copper (Cu) with Gold plated pads | Copper (Cu) | Copper (Cu) |
| Resistors | Surface mount packages Cermet screened on resistive material | Surface mount packages Cermet screened on resistive material | Surface mount packages | Surface mount packages | Through hole packages |
| Processes | Sequence: Print, Dry, Fire (conductor, dielectric, resistor pastes) Automated surface mount component placement Reflow solder Die Attach Wire bonding | Sequence: Print, Dry, Fire (conductor, dielectric, resistor pastes) Automated surface mount component placement Reflow solder Die Attach Wire bonding | Sequence: Screen solder paste Automated surface mount component placement Reflow solder Die Attach Wire bonding | Sequence: Screen solder paste Automated surface mount component placement Reflow solder | Sequence: Through hole insertion Wave Solder |
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SURFACE MOUNT
SURFACE MOUNT
SMT provides excellent space utilization and a very high degree of circuit reliability.
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THROUGH-HOLE PCB
THROUGH-HOLE PCB
Our through-hole PCB assembly procedure can handle both leaded and lead-free (RoHs) applications.
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HYBRID THICK FILM
HYBRID THICK FILM
A Hybrid circuit performs all or part of an electronic function by combining and interconnecting...
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CHIP ON-BOARD
CHIP ON-BOARD
When design parameters cannot be met by traditional assembly techniques, Chip-On-Board (COB)...
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MULTI-CHIP MODULE
MULTI-CHIP MODULE
MCM has the same basic construction as Chip-On-Board but with some significant differences.
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BOX BUILD ASSEMBLY
BOX BUILD ASSEMBLY
Box build assembly consists of all the remaining assembly processes required to integrate...
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International Sensor Systems is a manufacturer of custom electronic assemblies. Our Mission is to supply superior product quality and excellent customer service specifically to the Industrial, Military, and Medical marketplaces. We have a dedicated staff of employees who are undeniably an essential part of our business. In addition, using advanced technology, ISSI consistently meets or exceeds our customers' expectations.
LINKS
CONTACT US
103 Grant Street, PO Box 345
Aurora, NE 68818
Phone: 402-694-6111
Toll-Free: 800-260-6287
Fax: 402-694-6180