MANUFACTURING

Comparison Chart

 Multichip ModuleThick film HybridChip-on-BoardSurface MountThrough Hole
DescriptionUtilizes multiple unpackaged die on a single, multi-layer laminate or ceramic substrate.Utilizes thick film technology on ceramic substrate. Component attachment may be surface mount or die and wire. May utilize printed resistors.Utilizes die and wire technology on rigid or flex laminate substrateUtilizes surface mount technology on rigid or flex laminate substrateUtilizes through hole technology on rigid or flex laminate printed circuit board (PCB)
Base
Material
Alumina (AL2O3), Aluminum Nitride (AIN). Beryllia (BeO)
Glass Epoxy
Polyimide-Kevlar
Laminate sheets Flex
Alumina (AL2O3),
Aluminum Nitride (AIN),
Beryllia (BeO)
Glass-Epoxy
Polyimide-Kevlar
Laminate sheets
Flex
Glass Epoxy
Polyimide-Kevlar
Laminate sheets
Flex
Glass-Epoxy
Polyimide-Kevlar
Laminate sheets
Flex
ConductorsGold (Au)
Palladium Gold (PdAu)
Platinum (Pt
Silver (Ag
Palladium Silver (PdAg)
Copper (Cu)
Gold (Au)
Palladium Gold (PdAu)
Platinum (Pt)
Silver (Ag)
Palladium Silver (PdAg)
Copper (Cu)
with Gold plated pads
Copper (Cu)Copper (Cu)
ResistorsSurface mount packages
Cermet screened on resistive material
Surface mount packages
Cermet screened on resistive material
Surface mount packagesSurface mount packagesThrough hole packages
ProcessesSequence:
Print, Dry, Fire
(conductor, dielectric, resistor pastes)
Automated surface mount component placement
Reflow solder
Die Attach
Wire bonding
Sequence:
Print, Dry, Fire
(conductor, dielectric, resistor pastes)
Automated surface mount component placement
Reflow solder
Die Attach
Wire bonding
Sequence:
Screen solder paste
Automated surface mount component placement
Reflow solder
Die Attach
Wire bonding
Sequence:
Screen solder paste
Automated surface mount component placement
Reflow solder
Sequence:
Through hole insertion
Wave Solder

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SURFACE MOUNT

SURFACE MOUNT
SMT provides excellent space utilization and a very high degree of circuit reliability.
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THROUGH-HOLE PCB

THROUGH-HOLE PCB
Our through-hole PCB assembly procedure can handle both leaded and lead-free (RoHs) applications.
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HYBRID THICK FILM

HYBRID THICK FILM
A Hybrid circuit performs all or part of an electronic function by combining and interconnecting...
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CHIP ON-BOARD

CHIP ON-BOARD
When design parameters cannot be met by traditional assembly techniques, Chip-On-Board (COB)...
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MULTI-CHIP MODULE

MULTI-CHIP MODULE
MCM has the same basic construction as Chip-On-Board but with some significant differences.
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International Sensor Systems is a manufacturer of custom electronic assemblies. Our Mission is to supply superior product quality and excellent customer service to the Industrial, Military, and Medical marketplaces. We have a dedicated staff of employees who are an essential part of our buisness. Using advanced technology, ISSI consistantly meets or exceeds our customers' expectations.

CONTACT US

103 Grant Street, PO Box 345
Aurora, NE 68818
Phone: 402-694-6111
Toll-Free: 800-260-6287
Fax: 402-694-6180