Hybrid circuits perform all or part of an electronic function by combining and interconnecting several passive and active semiconductor devices into a single package.
International Sensor Systems’ hybrid circuits provide superior circuit density, performance, and reliability, with relatively low development and tooling costs. ISSI provides over 45 years of experience in the design and manufacture of thick-film hybrid products for high-reliability application in the industrial, medical, and military markets. ISSI provides the complete solution to your manufacturing problems including everything from initial layout design to final testing and inspection.
There are a variety of options for base materials of thick film substrates depending on the customer’s specific needs, such as Alumina (AL203), Aluminum nitride (AIN) or Beryllia (BeO). The selected substrate will be screen-printed with the conductor pattern and thick film resistors. Screen-printed resistors provide numerous benefits, including better tracking, improved interconnect reliability and package design flexibility through size reduction. The printed paste is then fired in tightly monitored temperature controlled, multi-zoned furnaces, binding the paste to the base material and becoming an integral part of the hybrid circuit. Passive and active semiconductor packages are then re-flowed onto the printed substrate. Bare die are attached to the substrate with epoxy and interconnected with gold wire bonds. A variety of lids or coatings may be applied to protect the die and wire bonds.
PACKAGE AVAILABLE FOR HYBRID THICK FILM ASSEMBLY AT ISSI:
Ceramic, metal, or plastic covers with adhesive seals
Circuit sealing using junction coating, lids, and other conventional coating materials
Hermetic and non-hermetic packages
Features of Hybrid Thick Film Technology from ISSI:
Further space savings over surface mount technology
Alumina (AL203), Aluminum Nitride (AIN), and Beryllia (BeO) base materials for excellent heat dissipation
Superior base material power dissipation – Alumina (AL203) high level - 1 Watt per inch per degree C, Aluminum Nitrate (AIN) high level - 7 watts per inch per degree C
Very compact with low profile and low mass
Provides reliable performance in extreme temperature operating ranges
Improved signal-to-noise ratio laminate technologies
Printed thick film resistors trimmed to exacting values
Power rating range one-sixteenth (1/16) to five (5) Watts
Precision Resistors to one-tenth of one percent (0.1%)
Ration matching to one-tenth of one percent (0.1%)
Epoxy and eutectic semi-conductor die attach
Gold thermosonic wire bonding with wire diameters from .0007 to .003 inch.
Re-flow soldering passive component attachment
Wide selection of solder paste and thick film inks available
Assembled, inspected, and tested to MIL-STD and IPC specifications
A full range of electrical and environmental testing available
Temperature Coefficient Resistance (TCR) as low as 50 ppm with tracking TCR’s to 20 ppm
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International Sensor Systems is a manufacturer of custom electronic assemblies. Our Mission is to supply superior product quality and excellent customer service to the Industrial, Military, and Medical marketplaces. We have a dedicated staff of employees who are an essential part of our buisness. Using advanced technology, ISSI consistantly meets or exceeds our customers' expectations.