Hybrid Circuits – Thick Film Assembly

Hybrid circuits perform all or part of an electronic function by combining and interconnecting several passive and active semiconductor devices into a single package.

International Sensor Systems’ hybrid circuits provide superior circuit density, performance, and reliability, with relatively low development and tooling costs. ISSI provides over 45 years of experience in the design and manufacture of thick-film hybrid products for high-reliability application in the industrial, medical, and military markets. ISSI provides the complete solution to your manufacturing problems including everything from initial layout design to final testing and inspection.

There are a variety of options for base materials of thick film substrates depending on the customer’s specific needs, such as Alumina (AL203), Aluminum nitride (AIN) or Beryllia (BeO). The selected substrate will be screen-printed with the conductor pattern and thick film resistors. Screen-printed resistors provide numerous benefits, including better tracking, improved interconnect reliability and package design flexibility through size reduction. The printed paste is then fired in tightly monitored temperature controlled, multi-zoned furnaces, binding the paste to the base material and becoming an integral part of the hybrid circuit. Passive and active semiconductor packages are then re-flowed onto the printed substrate. Bare die are attached to the substrate with epoxy and interconnected with gold wire bonds. A variety of lids or coatings may be applied to protect the die and wire bonds.

Hybrid Circuits

PACKAGE AVAILABLE FOR HYBRID THICK FILM ASSEMBLY AT ISSI:

Ceramic, metal, or plastic covers with adhesive seals

 

Circuit sealing using junction coating, lids, and other conventional coating materials

 

Hermetic and non-hermetic packages

 

Features of Hybrid Thick Film Technology from ISSI:

Further space savings over surface mount technology

 

Alumina (AL203), Aluminum Nitride (AIN), and Beryllia (BeO) base materials for excellent heat dissipation

 

Superior base material power dissipation – Alumina (AL203) high level - 1 Watt per inch per degree C, Aluminum Nitrate (AIN) high level - 7 watts per inch per degree C

 

Very compact with low profile and low mass

 

Provides reliable performance in extreme temperature operating ranges

 

Improved signal-to-noise ratio laminate technologies

 

Printed thick film resistors trimmed to exacting values

 

Power rating range one-sixteenth (1/16) to five (5) Watts

 

Precision Resistors to one-tenth of one percent (0.1%)

 

Ration matching to one-tenth of one percent (0.1%)

 

Epoxy and eutectic semi-conductor die attach

 

Gold thermosonic wire bonding with wire diameters from .0007 to .003 inch.

 

Re-flow soldering passive component attachment

 

Wide selection of solder paste and thick film inks available

 

Functional modularity

 

Assembled, inspected, and tested to MIL-STD and IPC specifications

 

A full range of electrical and environmental testing available

 

Temperature Coefficient Resistance (TCR) as low as 50 ppm with tracking TCR’s to 20 ppm

 

Want to know how we can help your business?

 

Which technology is right for you?

Check out our comparison chart.

SURFACE MOUNT

SURFACE MOUNT
SMT provides excellent space utilization and a very high degree of circuit reliability.
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THROUGH-HOLE PCB

THROUGH-HOLE PCB
Our through-hole PCB assembly procedure can handle both leaded and lead-free (RoHs) applications.
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HYBRID THICK FILM

HYBRID THICK FILM
A Hybrid circuit performs all or part of an electronic function by combining and interconnecting...
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CHIP ON-BOARD

CHIP ON-BOARD
When design parameters cannot be met by traditional assembly techniques, Chip-On-Board (COB)...
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MULTI-CHIP MODULE

MULTI-CHIP MODULE
MCM has the same basic construction as Chip-On-Board but with some significant differences.
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International Sensor Systems is a manufacturer of custom electronic assemblies. Our Mission is to supply superior product quality and excellent customer service to the Industrial, Military, and Medical marketplaces. We have a dedicated staff of employees who are an essential part of our buisness. Using advanced technology, ISSI consistantly meets or exceeds our customers' expectations.

CONTACT US

103 Grant Street, PO Box 345
Aurora, NE 68818
Phone: 402-694-6111
Toll-Free: 800-260-6287
Fax: 402-694-6180