Multi-Chip Module

Multi-Chip Module (MCM) has the same basic construction as Chip-On-Board but with some significant differences. Adding multiple integrated circuits allow us to combine more circuit functions into one multichip module.

MCM has the same basic construction as COB but with some significant differences. Adding multiple integrated circuits allow us to combine more circuit functions into one multichip module, which further reduces circuit size and mass.

Ceramic substrate construction also provides superior thermal heat dissipation capability in harsh environments, making MCM an excellent choice for many industrial applications.

The MCM footprint is much smaller than conventional single chip packages. The smaller motherboard, and potentially smaller space requirements for panels, enclosure, and cabling result in a high-density module that resembles a single component when mounted on your printed circuit board.

Multi-Chip Module

Compact packaging design

 

High level of thermal protection and heat dissipation

 

Circuit sealing using a variety of lids or conventional coating materials

 

Aluminia (AL203), Aluminum Nitride (AIN), Beryllia (BeO) substrate materials

 

Electrical and environmental testing available

 

Improved signal-to-noise ratio

 

Multi-layer substrates

 

Package layout and design capabilities

 

Electrical and environmental testing available

 

Assembled, tested, and inspected to MIL-STD and IPC specifications

 

Full turnkey assemblies available

 

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Which technology is right for you?

Check out our comparison chart.

SURFACE MOUNT

SURFACE MOUNT
SMT provides excellent space utilization and a very high degree of circuit reliability.
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THROUGH-HOLE PCB

THROUGH-HOLE PCB
Our through-hole PCB assembly procedure can handle both leaded and lead-free (RoHs) applications.
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HYBRID THICK FILM

HYBRID THICK FILM
A Hybrid circuit performs all or part of an electronic function by combining and interconnecting...
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CHIP ON-BOARD

CHIP ON-BOARD
When design parameters cannot be met by traditional assembly techniques, Chip-On-Board (COB)...
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MULTI-CHIP MODULE

MULTI-CHIP MODULE
MCM has the same basic construction as Chip-On-Board but with some significant differences.
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International Sensor Systems is a manufacturer of custom electronic assemblies. Our Mission is to supply superior product quality and excellent customer service to the Industrial, Military, and Medical marketplaces. We have a dedicated staff of employees who are an essential part of our buisness. Using advanced technology, ISSI consistantly meets or exceeds our customers' expectations.

CONTACT US

103 Grant Street, PO Box 345
Aurora, NE 68818
Phone: 402-694-6111
Toll-Free: 800-260-6287
Fax: 402-694-6180